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TL16C750: The availability and EOL potential

Part Number: TL16C750

Dear TI Team

Our customers are considering TL16C750FN (PLCC package) or TL16C750PM (LQFP package).
However, they are concerned about the availability and EOL potential of these products.
I want you to answer the following questions.

1. Which is in demand worldwide, the TL16C750FN or the TL16C750PM?
(Which one has the larger supply?)
2. Since I think the LQFP package is newer than the PLCC package, I recognize that the TL16C750PM is less likely to be an EOL than the TL16C750FN in the future.
Is the above recognition correct?

Best Regards,

Y.Ottey

  • As far as I know, TI will not publicly make such predictions about the future.

    The PLCC package happens to have a larger supply. This package is offered for backwards compatibility with existing designs, which might be the most important application for this device.

    Under supply/demand considerations, the customer should consider the TL16C750E in the 48-TQFP package.

  • Hi Y.Ottey,

    As Clemens has pointed out, I can't state the lifetime availability of any device. 

    Again as Clemens has answered, the device which is the newest (also in the latest process technology) is the 750E device. I point this out because TI has officially stated they would be closing down some old process fabs (150mm process technology) in the next 3 to 5 years as they ramp up on a new 300mm wafer fab. The list of devices that are in these processes have not been made public yet, as to my knowledge, so I cannot comment on the older non E version of the 750.

    -Bobby