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TLIN1028-Q1: GND and thermal PAD

Dongbao Zhou
Expert 4170 points
Part Number: TLIN1028-Q1

Hello,

I have few questions from customer about the GND and thermal pad:

  1. Is there connection between GND and thermal pad?
  2. Why thermal pad is required to solder to GND plane in d.s?
  3. What are the connections between thermal pad and internal circuit?

Regards,

Dongbao

  • 0
    TI__Guru 53555 points

    Hi Dongbao,

    Thanks for bringing this question to E2E!

    1. There is no internal connection between the thermal pad and GND. Electrically, the thermal pad is a N.C.

    2. It is recommended to solder the thermal pad to GND because the ground plane is most often the largest copper pour on the board. The thermal pad on TLIN1028-Q1 is meant to dissipate heat generated by the SBC and transfer it to another conductor so that the device does not overheat. A large copper pour will be most effective at disperse heat throughout its thermal mass and provide the most surface area to further dissipate the energy into the environment.

    3. I believe the thermal pad is internally connected to the substrate inside the IC to increase heat transfer efficiency.

    Let me know if you have any more questions.

    Regards,
    Eric Schott