AM26C31: esd and soldering of AM26C31

Frank Xiao

Genius 12055 points

Part Number: AM26C31

Hi team,

My customer want to use our AM26C31, could you please share the ESD performance(HBM, CDM ) of the device? Also shared the reflow soldering peak temperature and Dwelling time on peak temperature?(260°C, 30s?). Thanks.

over 4 years ago

0 Eric Hackett over 4 years ago

TI__Guru 73112 points

Frank,

The ESD performance for this device, both HBM and CDM, are located in the datasheet in the Absolute Maximum section. For soldering reflow, we recommend following the IPC/JEDEC J-STD-020D standard and the recommendations from the solder paste vendor.

For some more information from TI application notes:

MSL Ratings and Reflow Profiles (Rev. A)

Solder Pad Recommendations for Surface-Mount Devices (Rev. A)

Absolute Maximum Ratings for Soldering (Rev. D)

Please let me know if this helps, or if you need more information.

Regards,

Interface

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AM26C31: esd and soldering of AM26C31