Hello E2E,
Please let me know about ZWS package.
Q1:
Are the pin assignments for ZWS and ZGU the same?
Q2:
There was no mention of ZWS in PCN. Is it because there was no ZWS when the PCN was issued?
Regards,
ACGUY
This thread has been locked.
If you have a related question, please click the "Ask a related question" button in the top right corner. The newly created question will be automatically linked to this question.
ACGUY
Please see this app note, www.ti.com/.../sllz077.pdf.
The devices in the MicroStar BGA™ packaging were redesigned using a laminate nfBGA package. The nfBGA package offers data sheet-equivalent electrical performance and data sheet-equivalent or better thermal performance. It provides the same X and Y dimensions as MicroStar BGA, and provides pin-to-pin and footprint compatibility.
Thanks
David