HD3SS214: package issue

Jeff YANG

Part Number: HD3SS214

Hi,

I saw the HD3SS214 status is last time buy because the package was changed, I saw the document as below

"Due to an equipment End-Of-Life notice from our substrate supplier, we are phasing out certain MicroStar BGA and MicroStar Junior™ BGA packaging devices and offering a Last Time Buy. These devices have now been converted to an nfBGA package."

But I don't find HD3SS214 package ZQE in table1.2 device affected list. So if our customer want to order this part, just keep used HD3SS214ZQER to order this part, right?

Another question is about footprint, it also have some changed? need suggest my customer follow this document redesign the footprint?

Thanks!

Jeff

over 4 years ago

0 David (ASIC) Liu over 4 years ago

TI__Guru**** 177301 points

Jeff

The HD3SS214 is migrating from current jrBGA microstar package to a nFBGA package. But the two packages are pin-to-pin compatible with each other so there is no need to change the existing footprint.

Thanks

David

0 Jeff YANG over 4 years ago in reply to David (ASIC) Liu

Mastermind 7865 points

Hi David,

As I know the last time buy expire in May 20, 2021, after that time, is there any alternative part can use? thanks!

Jeff

0 David (ASIC) Liu over 4 years ago in reply to Jeff YANG

TI__Guru**** 177301 points

Jeff

Please order the HD3SS214ZXHR which is pin-to-pin with the current HD3SS214ZQER.

Thanks

David

0 Jeff YANG over 4 years ago in reply to David (ASIC) Liu

Mastermind 7865 points

Hi David,

I can't find any information about HD3SS214"ZXH", is there have any document can share to my customer?

They are afraid this part goes to EOL. thanks!

Jeff

0 David (ASIC) Liu over 4 years ago in reply to Jeff YANG

TI__Guru**** 177301 points

Jeff

Please refer to the ZXH mechanical drawing,

Thanks

David

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HD3SS214: package issue