Hello,
could someone from TI please clarify whether the internal Die/Chip is exactly the same in ZWS und ZGU or not? This may have an impact on our migration strategy/steps (verification etc).
Thanks
This thread has been locked.
If you have a related question, please click the "Ask a related question" button in the top right corner. The newly created question will be automatically linked to this question.
Hello,
could someone from TI please clarify whether the internal Die/Chip is exactly the same in ZWS und ZGU or not? This may have an impact on our migration strategy/steps (verification etc).
Thanks