DP83867IR: Recommended solder void for thermal pad (HTQFP package)

Hello Experts,

Please help with the inquriies.

Regards,

JH

Hi JH,

Our team is currently looking into your questions and we will provide a response by this upcoming Wednesday.

Kind Regards,

Joe

All information in this correspondence and in any related correspondence is provided “AS IS” and “with all faults”, and it is subject to TI’s Important Notice (www.ti.com/.../important-notice.shtml).

Hi JH,

I apologize for the late response. Typically we allow up to 50% voiding but have seen other applications which had up to 70% voiding still not seeing a significant impact. There are a variety of factors but in general the 50% voiding is where we recommend targeting as a maximum amount of voiding based on a HighK board and Theta Ja thermal metric.

Please let me know if you need any clarification and/or additional information.

Kind Regards,

Joe

All information in this correspondence and in any related correspondence is provided “as is” and “with all faults”, and is subject to TI’s Important Notice (http://www.ti.com/corp/docs/legal/important-notice.shtml)