DP83867IR: Package parameters related to estimate BLR

Takashi Onawa

Part Number: DP83867IR

Hi Team,

Could you tell me the following package parameters of DP83867IRPAP?
My customer need such the parameter to estimate BLR(Board level reliability) of the their own board
- Thermal expansion coefficient
- Young's modulus

Regards,

Takashi Onawa

over 4 years ago

0 Joe Vanacore over 4 years ago

TI__Genius 17360 points

Hi Takashi,

Please take a look at section 7.4 Thermal Information in the datasheet.

For more information, I suggest you please look at this application report linked below this section's table: http://www.ti.com/lit/pdf/spra953

Please let me know if you have any further questions.

Kind Regards,

Joe

All information in this correspondence and in any related correspondence is provided “as is” and “with all faults”, and is subject to TI’s Important Notice (http://www.ti.com/corp/docs/legal/important-notice.shtml)

0 Joe Vanacore over 4 years ago in reply to Joe Vanacore

TI__Genius 17360 points

Hi Takashi,

I haven't heard back from you. If there are no further questions, I will close this thread.

Kind Regards,

Joe

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DP83867IR: Package parameters related to estimate BLR