Hello,
I'm trying to get CD74ACT32M96 approved by our board which includes Lockheed martin and Government subject matter experts.
Could I please get the following information for CD74ACT32M96 (SOIC package, NIPdAu)
- Assembly site?
- Wafer fab site?
- Mold Compound(metal Enclosure)?
- Die Attach Material?
- Wire Bonds?