SN74LS86A: Wave Solder Conditions for SN74LS86A

Tatsuya Takahashi

Part Number: SN74LS86A

Hi team

Good day!

I referred the Application Report " Wave Solder Exposure of SMT Packages" for Wave Solder Conditions for SN74LS86A.
And I have question about preheat temperature in this Application Report.

Could you share the measurement point for preheat temperature?
Is it component terminals, or component surface?

Best regards
Takahashi

over 2 years ago

0 Emrys Maier over 2 years ago

TI__Guru* 96591 points

Hello Takahashi-san,

I'm afraid I don't know the method used for measuring the temperature of the component during testing.

Are you having trouble with wave soldering one of of our components?

0 Tatsuya Takahashi over 2 years ago in reply to Emrys Maier

Prodigy 40 points

Hello Emrys-san,

My trouble is that preheat time of our flow profile does not comply flow profile for SN74LS86A.
I want to actually verify that SN74LS86A can implement or not.

About preheat time, our profile is 90sec. Preheat time for SN74LS86A is 80sec from Application Report " Wave Solder Exposure of SMT Packages" for Wave Solder.

I think solder is not used in preheat condition.
So I want to know where I need to check the temperature for preheat.

Do you have any suggestion?

Best regards
Takahashi

0 Emrys Maier over 2 years ago in reply to Tatsuya Takahashi

TI__Guru* 96591 points

My recommendation would be to measure at the pins if possible - after all, that's where the solder is going.

0 Tatsuya Takahashi over 2 years ago in reply to Emrys Maier

Prodigy 40 points

Thank you for your recommendation.
This won't break even if to heat at the SN74LS86A's pins by Wave Solder Simulation Conditions in JESD22A111?

Application Report " Wave Solder Exposure of SMT Packages" has Wave Solder Simulation Conditions in JESD22A111.

+1 Emrys Maier over 2 years ago in reply to Tatsuya Takahashi

TI__Guru* 96591 points

I would recommend that you run a test of your process to verify that it won't cause issues for your design.

As described in JESD22A111:

"...packages that would be attached by wavesolder immersion require special evaluations by the USER due to the wavesolder process differences."

0 Tatsuya Takahashi over 2 years ago in reply to Emrys Maier

Prodigy 40 points

Thank you for your support.
I will try to run a test of our process to verify.

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SN74LS86A: Wave Solder Conditions for SN74LS86A