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SN74LVC1G08: Packaging information - datasheet question

Part Number: SN74LVC1G08

Hello Experts,

My customer looks at replacing SN74LVC1G08DBVR with SN74LVC1G08DBVRG4.

But after reading page 14 from device datasheet there are questions:

What is the difference in ball finish: NIPDAU | SN vs. NIPDAU  - what does it mean that tin is missing from the ball material? Customer is wondering how that will affect their assembly process.

Why the operating temp cell for SN74LVC1G08DBVRG4 is empty?

  • Hi Piotr,

    NiPDAu has no whiskers or solderability issues compared to Sn. You can find more in depth information on NiPDAu here. There is a typo in the operating temperature, the correct operating temperature for the SN74LVC1G08DBVRG4 is -40°C to 125°C


    Sebastian Muriel 

  • Footnote (6) says:

    Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line.

    When you order "SN74LVC1G08DBVR", you might get chips with NiPdAu finish, or chips with Sn finish. It's likely the customer already got NiPdAu (without Sn) devices earlier.

    As shown in the recommended operating conditions, all devices have the same –40 °C to 125 °C range.