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solderbility isssue in IC SN74LVC1G17QDBVRQ1

Umesh Salhotra
Prodigy 10 points


We have facing solderbility issue in IC SN74LVC1G17QDBVRQ1.PCB and solder paste is fine. After passing through reflow, IC is removed automatically.

Please give us solution ASAP.

  • 0
    TI__Guru* 97066 points

    Hi Umesh,

    The DBV package is widely used without issues -- this is the first problem I have heard of with soldering it. My first recommendation would be to recheck the reflow profile, footprint, solder mask, and solder deposition. I can review these items if you can provide details (images of board after reflow, footprint (altium files preferred), solder stencil design, type of solder paste used, reflow profile (time & temp), etc)

    If this all checks out, my next recommendation would be to start a failure analysis (FA) return with your distributor to determine the root cause of the issue.