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SN74AXC4T774: BQB (WQFN) package thermal tab

Part Number: SN74AXC4T774

The BQB package contains a thermal tab (unlike the other packages).  The datasheet makes no mention of tying it to ground or any other level (only "The package thermal pad must be soldered to the printed circuit board for optimal thermal and mechanical performance.").  The Ultra Librarian CAD ties it to ground.  I have two questions:  May the thermal tab be tied to ground?  May the thermal tab be tied to anything other than ground?