Do we have information about the RθJC(bot) of the SN74AXC8T245-Q1 (PW Package)?
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Thank you for your response. We asked for this specification as our customer thinks that the RθJC(top) specification would not be accurate to be used since power exits through bottom of device. Is this the case? Can you help us clarify?
The PW is a TSSOP package that has a full plastic body with no thermal pad. This means that this package does not have a RθJC(top) specification because there is no pad under the package for heat to flow out from. https://www.ti.com/lit/ml/mpds363a/mpds363a.pdf
Please see the following FAQ to calculate power consumption: