What was TI's wafer process designation in 2001 and what is TI's wafer process designation today for the LVC and LVCH logic devices?
I would like to determine if the radiation characteristics (TD and SEU) of these devices has changed since 2001.
If the wafer process hasn't changed, then I can assume that new devices will have the same characteristics as the early devices. We use QML Class Q.
Where would I find out that information?
