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SN74AVC8T245: Customer has PCB layout questions

Part Number: SN74AVC8T245

Hi Team,

My customer designed this chip but their layout engineer has some design questions and need our explanation.

1. On datasheet  page 30, as shown in the figure below. There are pin solder mask design with different outline, one is 0.07max, the other is 0.07min. What is the difference between the two outline definition?

2. On Page 31 of the datasheet shows that the solder mask is an inner green box (left in the figure below), what is the blue outside? And from our EVM's BRD file (right in the figure below) has a pastemask inside and a solder mask outside. Which one is correct?

3. In addition, on page 31 of the datasheet, what is the gap of the red boxes inside the IC (marked by the purple line)?

Thanks

  • Hi Paul,

    1. On datasheet  page 30, as shown in the figure below. There are pin solder mask design with different outline, one is 0.07max, the other is 0.07min. What is the difference between the two outline definition?

    This post on digikey explains the difference between NSMD and SMD very well:https://forum.digikey.com/t/solder-mask-defined-and-non-solder-mask-defined-in-pad/2069 

    3. In addition, on page 31 of the datasheet, what is the gap of the red boxes inside the IC (marked by the purple line)?

     I believe you should be able to place the red boxes correctly based on the dimension I have highlighted. 

    2. On Page 31 of the datasheet shows that the solder mask is an inner green box (left in the figure below), what is the blue outside? And from our EVM's BRD file (right in the figure below) has a pastemask inside and a solder mask outside. Which one is correct?

    For this question, we don't know exactly who makes these drawings. Our best recommendation is to go to this customer support site and try to get in touch with the appropriate team: Customer support center