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SN74AUP2G32: SN74AUPxGxxYFPR (BGA 0.4mm) surface material and assembly issues

Etienne Paternoster
Prodigy 30 points
Part Number: SN74AUP2G32


Hi,

I've used a number of logic gates with a part number SN74AUPxGxxYFPR (SN74AUP2G32YFPR, SN74AUP3G14YFPR, SN74AUP1G74YFPR, etc..) in a design currently in production (few hundreds of pieces). These parts are made of a reflective glass-like material.

Both assembly companies that solder this design complain (at different levels) about these references, for 3 reasons:

- They are reflective, which causes issues with their automated tools;

- They move/jump out of the band when picked-up by the pick-and-place machine;

- They are very fragile and crack easily.

What is so different between this package material and more "standard" ones?

Are there any workarounds known to mitigate these issues?

Is there a way of knowing the material from the datasheet (or elsewhere)?

Additionnaly, I've used both TPS63805YFF and TPS63807YFF, the former seemed to have a "standard" material when the later had a reflective one, but nothing in the datasheet differentiates the packages; Can such a change in material occur for the same MPN without notice?

Thanks,

Étienne.

  • 0
    TI__Mastermind 20340 points

    Hi Étienne,

    Etienne Paternoster said:
    What is so different between this package material and more "standard" ones?

    For the YFP package, (Also called Wafer Chip Scale Package WCSP), the die is the package. 

    This application report compares "standard" packages to the WCSP packages: https://www.ti.com/lit/an/sbva017/sbva017.pdf 

    Etienne Paternoster said:
    Is there a way of knowing the material from the datasheet (or elsewhere)?

    Depending on what package you choose, the material can be different. 

    You can find the material for a device using the orderable part number. Ex: SN74AUP2G32YFPR. Use that orderable part number to search the material content on our website here: https://www.ti.com/materialcontent/home 

    This application report goes into detail regarding WCSP packages: DSBGA Wafer Level Chip Scale Package\

    Etienne Paternoster said:
    Additionnaly, I've used both TPS63805YFF and TPS63807YFF, the former seemed to have a "standard" material when the later had a reflective one, but nothing in the datasheet differentiates the packages; Can such a change in material occur for the same MPN without notice?

     I don't support these devices, could you please post this question on the power management forum?

    Regards,

    Sebastian