Hello, the datasheet Rev L shows pin numbers and names for each package device on Page 1. For the 6-pin BGA package YZP it references as balls 1 to 6. However, the YZP IC package drawing YZP0006 (DSBGA) shows the numbering as A1, A2, B1 etc. I presume pin A1 = pin 1 (IN1) as the drawing on Page 1 is viewing the packing from the bottom? Note the IBIS model doesn't help either as it references the pins for the YZP package as 1-6 instead of A1, A2 etc too.