[FAQ] SN74HCS00: The Logic Industry's Smallest Leaded Package; DYY

The Logic Industry’s Smallest Leaded Package; SOT-23-THIN (DYY)

                Many companies still rely solely on optical verification methods to ensure their components have been successfully soldered and are unwilling or not yet able to move to x-ray technology for their manufacturing. With space at a premium, dual sourced supply as a primary concern, and manufacturing compatibility with existing infrastructure set at top priority these companies turn to the logic industry’s smallest leaded package.

Figure 1. Package comparison of DYY and other industry standard leaded packages

SOT-23-THIN (DYY) is the logic industry’s smallest leaded package providing many manufacturers a great middle ground solution for addressing manufacturing, supply, as well as PCB design constraints. The DYY package is now being offered by Texas Instruments in a multitude of mainstay logic components such as gates, buffers, and shift registers (offered in both automotive/commercial variants) and is revolutionizing board design.

Figure 2. Example of PW and DYY package dual footprint layout (measured in board space used not overall package size)

The SOT-23-THIN package is an excellent choice for those concerned about ensuring dual sourced supply. This package can be designed into boards with a dual-footprint layout with many of the industry’s most popular package choices. This allows manufacturers to utilize multiple package offerings of the same device without re-designing their PCB providing ultimate design flexibility. For more information about this design methodology and to see if it’s right for you please see Optimizing Board Design for Supply Constrained Environments.  

                There are many other benefits to utilizing a small footprint leaded package like SOT-23-THIN (DYY) including but not limited to:

1. Simplified PCB design
2. Ability to utilize current manufacturing process/infrastructure with no changes required
3. Better thermal cycling performance
4. Price reduction in manufacturing for materials like solder paste compared to leaded package variants

Below are new devices released from TI in SOT-23-THIN (DYY) Packaging.

Figure 3. Newly released commercial DYY offerings and sector-based end equipment use cases

Figure 4. Newly released automotive DYY offerings and sector-based end equipment use cases

References and Additional Resources

Texas Instruments Logic Guide

16 Pin DYY Test Board User's Guide

 Optimizing Board Design for Supply Constrained Environments

Texas Instruments Package Selection Tool

Texas Instruments Logic Devices