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[FAQ] SN74HCS00: The Logic Industry's Smallest Leaded Package; DYY

Part Number: SN74HCS00

The Logic Industry’s Smallest Leaded Package; SOT-23-THIN (DYY)

                Many companies still rely solely on optical verification methods to ensure their components have been successfully soldered and are unwilling or not yet able to move to x-ray technology for their manufacturing. With space at a premium, dual sourced supply as a primary concern, and manufacturing compatibility with existing infrastructure set at top priority these companies turn to the logic industry’s smallest leaded package.

SOT-23-THIN (DYY) Size

Alternate Package Size

Total Space Savings

14 pin DYY 8.4mm²

14 pin TSSOP (PW) 22mm²

13.6mm²  (61.8% smaller)

16 pin DYY 8.4mm²

16 pin TSSOP (PW) 22mm²

13.6mm²  (61.8% smaller)

14 pin DYY 8.4mm²

14 pin SOIC (D) 33.8mm²

25.4mm²  (75.1% smaller)

16 pin DYY 8.4mm²

16 pin SOIC (D) 38.7mm²

30.3mm²  (78.3% smaller)

Figure 1. Package comparison of DYY and other industry standard leaded packages

SOT-23-THIN (DYY) is the logic industry’s smallest leaded package providing many manufacturers a great middle ground solution for addressing manufacturing, supply, as well as PCB design constraints. The DYY package is now being offered by Texas Instruments in a multitude of mainstay logic components such as gates, buffers, and shift registers (offered in both automotive/commercial variants) and is revolutionizing board design.

Figure 2. Example of PW and DYY package dual footprint layout (measured in board space used not overall package size)

The SOT-23-THIN package is an excellent choice for those concerned about ensuring dual sourced supply. This package can be designed into boards with a dual-footprint layout with many of the industry’s most popular package choices. This allows manufacturers to utilize multiple package offerings of the same device without re-designing their PCB providing ultimate design flexibility. For more information about this design methodology and to see if it’s right for you please see Optimizing Board Design for Supply Constrained Environments.  

                There are many other benefits to utilizing a small footprint leaded package like SOT-23-THIN (DYY) including but not limited to:

  1. Simplified PCB design
  2. Ability to utilize current manufacturing process/infrastructure with no changes required
  3. Better thermal cycling performance
  4. Price reduction in manufacturing for materials like solder paste compared to leaded package variants

Below are new devices released from TI in SOT-23-THIN (DYY) Packaging.

OPN

Common EEs

Enterprise

Commercial

Personal Electronics

Industrial

SN74HCS74DYYR

 

Hardware accelerator, Rack/Blade server, High performance computing

 

Gateway (xDSL/cable), Datacenter switch, Wireless Lan (WLAN), Core/Edge router

 

 

Consumer IoT devices, Portable electronics, Data storage

 

 

Access control, Condition monitoring sensor, AC indoor unit

SN74HCS00DYYR

SN74HCS08DYYR

SN74HCS125DYYR

SN74HCS14DYYR

SN74HCS32DYYR

SN74HCS164DYYR

Figure 3. Newly released commercial DYY offerings and sector-based end equipment use cases

OPN

Automotive

SN74HCS74QDYYRQ1

Body electronics, Hybrid electric and powertrain systems, Infotainment and clusters

SN74HCS00QDYYRQ1

SN74HCS08QDYYRQ1

SN74HCS125QDYYRQ1

SN74HCS14QDYYRQ1

SN74HCS32QDYYRQ1

SN74HCS164QDYYRQ1

Figure 4. Newly released automotive DYY offerings and sector-based end equipment use cases

References and Additional Resources

Texas Instruments Logic Guide

16 Pin DYY Test Board User's Guide

 Optimizing Board Design for Supply Constrained Environments

Texas Instruments Package Selection Tool

Texas Instruments Logic Devices