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SN74AUP3G06: VSSOP DCU Landpattern information

kato makoto
Prodigy 90 points
Part Number: SN74AUP3G06

I'm supporting technical issue for Panasonic Biz in Satori TP japan. 

I could not find Land pattern information in SN74AUP3G06DCUR Data sheet.

Pankage type is "VSSOP DCU (8)".

Could you please shrear Land pattern information.

best regards

kato

  • 0
    TI__Guru* 97046 points

    Hello Kato-san,

    For any TI device, I would recommend to use the Ultra-librarian tool to download the appropriate footprint information.

    From the product folder, click on "Design & development"

    Then click on "CAD/CAE symbols"

    And finally select "View options" for the appropriate package

    This will take you to the Ultra-librarian site and will give you options for the type of editor you use.

  • 0 in reply to Emrys Maier
    Prodigy 90 points

    Hi Maler-san

    Thanks a lot your answer. But, I'm not solved .  I'm not use PCB CAD. 

    I have to make Shipping Specification by Document for Panasonic Biz.

    Could you please share the foot print dimension as a pdf file.

    Best rregards;

    kato  

  • 0 in reply to kato makoto
    TI__Guru* 97046 points

    Hello Kato-san,

    I'm afraid I don't have the ability to do that - I would recommend you reach out to the team that owns the pdf package drawing in the datasheet - ie the packaging team. They are the only ones that can modify that document.

  • 0 in reply to Emrys Maier
    Prodigy 90 points

    The SN74AUP3G06DCUR Data sheet have only External dimension information in VSSOP DCU(8). I asked the fooy print information to CSC group by  #C0JBAU000379. CSC Group could not answer the issue. They answer " the issue should be ask to E2E." Therfore, I'm ask in this system. 

  • 0 in reply to Emrys Maier
    TI__Guru* 97046 points

    Hello Kato-san,

    ごめんなさい My apologies - I mistook you for a TI employee.

    Panasonic has an assigned sales team within TI (who would usually be the ones to contact me here) - please get in touch with them so they can push the internal packaging team to get this for you. I can put in a request, but since TI has had the same method of documenting this package for many years, it may be difficult to get them to change it.

  • 0 in reply to Emrys Maier
    TI__Guru* 97046 points

    Upon contacting our packaging team, it seems that there is an existing drawing for the DCU footprint, but it is found in another datasheet currently. I have requested that they update the drawing for the AUP3G06 to match.

    https://www.ti.com/lit/ds/symlink/sn74lvc2g126.pdf