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Compare Discrete Logic Devices Die maps

Ali Rizvi
Prodigy 70 points
Other Parts Discussed in Thread: SN74LVC1G99-Q1, SN74LVC1G98-Q1, SN74LVC1G97-Q1

Hi 

 

I wanted to know whether dies used in each of the gate types are same or different:  This would help reduce number of candidates for qualification since we are planning to put them on our roadmap.

 

AND Logic Devices

TI

SN74LVC1G08IDCKRQ1

AND - Single

1.65V-5.5V

32, 32

5-TSSOP, SC-70-5, SOT-353

TI

SN74AC08QPWRG4Q1 / SN74AC08QPWRQ1

AND - Quad

2V-6V

24, 24

14-TSSOP

 

NOT Logic Devices

TI

SN74LVC1G14QDCKRQ1

NOT - Single

1.65V-5.5V

32, 32

5-TSSOP, SC-70-5, SOT-353

TI

SN74AC04QPWRG4Q1

NOT - HEX

2V ~ 6V

24, 24

14-TSSOP

 

Buffer Logic Devices

TI

SN74LVC1G17QDCKRQ1

BUFFER - Single

1.65V-5.5V

32, 32

5-TSSOP, SC-70-5, SOT-353

TI

SN74LVC2G17QDCKRQ1

BUFFER  - Dual

1.65V-5.5V

32, 32

6-TSSOP, SC-88, SOT-363

 

 

Regards

 

Ali Rizvi

CPE Components

Slb

281-285-4096

  • 0
    TI__Guru* 97046 points

    Hi Ali,

    Please contact your company's assigned TI sales team -- this is not the type of information I could share on a public forum.

  • 0
    Guru 316690 points

    AC and LVC are entirely different (from SCLA013):

    As for the buffers, their material content reports show that the weight of the die in the 2G devices is neither the same nor double that of the 1G devices.

    If reducing the number of gate types is worthwhile, consider using configurable multi-function gates, i.e., SN74LVC1G97-Q1, SN74LVC1G98-Q1, SN74LVC1G99-Q1.