Because of the holidays, TI E2E™ design support forum responses will be delayed from Dec. 25 through Jan. 2. Thank you for your patience.

  • State Resolved
  • Locked Locked
  • Replies 2 replies
  • Subscribers 18 subscribers
  • Views 200 views
  • Users 0 members are here
Support feedback
Options
Options
Similar topics

This thread has been locked.

If you have a related question, please click the "Ask a related question" button in the top right corner. The newly created question will be automatically linked to this question.

SN74LVC8T245-EP: Lead plating thickness etc

?? ??
Prodigy 10 points
Part Number: SN74LVC8T245-EP

This is an inquiry regarding the VQFN package  CLVC8T245MRHLTEP.

（ CLVC8T245MRHLTEP cannot be entered with Part number.）

Please provide the following data when adopting new parts.

If it is written in the data sheet, etc., please let me know where it is written.

・Lead plating thickness (NI, PD, AU thickness)

・Presence of packaging with dehumidifying packaging

・Is baking necessary?   (I think it's not necessary.)

・Possible number of reflows  (expect 3 times or more.)

・ device weight

・Structure diagram of parts

・Electrode structure diagram

Thanks、

Nobuyuki

  • 0
    TI__Mastermind 33765 points

    Hi Nobuyuki,

    Please note that your concerns are not application related and if more information is needed, the packaging team would be the best contact and below is all the information that can be provided as of this time, thanks.

    NIPDAU:

    • Ni: 0.25 - 1.25 um
    • Pd: 0.005 - 0.02 um
    • Au-Ag: 0.005 - 0.0625 um

    Baking was done.

    Reflow done for 260 deg C and  CONTROLLED WITHIN 8HOURS AFTER, POST MOLD CURE.

    For diagram structure please see datasheet package diagrams.

    Best Regards,

    Michael.

  • 0 in reply to Michael Ikwuyum
    Prodigy 10 points

    Hi Michel,

    I'm sorry that the contact information is different.
    The answer understood.

    Thanks,