Hi TI team,
Had there been a PCN of SN74HCT04ANSR that is to standardize the device marking?
I don't have any related PCN record on hand but received a contact from my customer stating that device marking has been changed.
Thank you.
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Hi TI team,
Had there been a PCN of SN74HCT04ANSR that is to standardize the device marking?
I don't have any related PCN record on hand but received a contact from my customer stating that device marking has been changed.
Thank you.
Hi Grace,
Top markings can change based on assembly sites. Two new assembly sites were added with this PCN https://www.mouser.com/PCN/Texas_Instruments_PCN20211220002_20211222120956220.pdf
Regards,
Owen
Dear Owen,
Since this notification only included new assembly sites but not mentioning the marking changes, customer would assume the marking remains the same regardless of assembly sites if TI hasn't issued PCN on marking changes. Does that mean the marking will change to new format and will not resume to old format? Or should customer expect different marking format if the chips are assembled in different sites?
Hi Grace,
Customers should expect different markings for different assembly sites. There is potential one reel ordered might resemble old format and the next could resemble new format.
-Owen
Dear Owen,
In PCN 20211220002.1, device SN74HCT04ANSR belonged to group 1. PCN details stated that only RFAB qualification was announced in this PCN, it didn't mention qualification of HFTF or TFME. How do you explain the marking difference if the assembly site is not changed?Thanks.
Hi Grace,
My mistake I missread the PCN. Yes the site did not change that being said my point is still valid that between assembly sites the top marking can change, and perhaps with this process update our internal teams took the opportunity to align the top marking with other parts in our portfolio.
Top markings are not required to be a part of PCNs as they do not affect the electrical characteristics of the device, or affect usage of the devices.
-Owen