Tool/software:

For the SN74AXC4T774-Q1 in the WQFN package there is a thermal pad as a part of the package.  The data sheet does not mention this nor if it is tied to gnd.  For this particular device should it be tied to ground (using via under pad) or left floating?

Most TI devices of this type the thermal pad is defined in "pin functions" and typically stated as tie to gnd with via.    

Thanks.