This thread has been locked.

If you have a related question, please click the "Ask a related question" button in the top right corner. The newly created question will be automatically linked to this question.

SN54AHC32: Die differences

Part Number: SN54AHC32
Other Parts Discussed in Thread: SN74AHC32,

Tool/software:

1) Do the SN54AHC32 and SN74AHC32 use the same die?

2) Can we use SN74AHC32 die for a hybrid device with operating case temp of -55 to 125 degC?

If NO, please identify the potential risks and possible mitigation.

If YES, what is the difference betn the two? What characterizes one as SN54* and the other as SN74* device.

Thanks.

  • The die might be the same, but it is not guaranteed. Anyway, bond wires, lead frame, and packaging are different, and SN54 devices get additional testing and qualification.

    And how would you get a SN74AHC32 die? Extracting it from the package would remove all guarantees.

    The SNx4AHC32 is not listed on ti.com/die-wafer-services/products.htmlIf you are a large enough customer that you get TI to sell you dies, it would be no problem to get military-rated dies.

  • What Clemens said is correct. The die is the same but undergoes more extensive testing/qualification and has different packaging. Removing the packaging invalidates the guaranteed operating temperature range of the SN54 device.

    Best,

    Malcolm