SN74AHCT132: SN74AHCT132DG4 Obsolescence

Thank you, we need a confirmation that the new version has the  same die layout revision, wafer fab, technology and packaging/materials. Finally it is exactly the same part, only the packing/conditioning is different? 

There are three assembly sites for the SN74AHCT132DR, but it is likely that only one of them made the chips sold as "SN74AHCT132DG4". So it is possible that you now get chips from a different site, which might have different dies/packaging.

We use your device SN74AHCT132DG4 in lounchers and the die has been tested in radiation. It is very important to know if inside is the same die. Otherwise we have to repeat the derisking radiation acivities. So please state on it. If some packaging materials have been changed, also we need to receive a comparison (mold compound, wires, lead frame..;etc).

The die is the same. Can you share the top marking/lot code for some of your existing devices?

Best,

Malcolm

We have tested DC 2019 (see below the pictures). Can you confirm is the same on SN74AHCT132DR?

Here is the die marking/revision

Here is the External part marking:  
Logo 9CC4QRK G4
AHCT132

Anna,

Sorry, I completely misread the original post. The HC132 is NOT the same die as the AHCT132.

Best,

Malcolm

Malcolm ,

Sorry it is a typo mistake we need to compare the SN74AHCT132DG4, which is really Obsolete and if it is the same device as SN74AHCT132DR

On your side we see that it is the case. We just We just need a confirmation that inside is the same die, the same packaging, just the packing method is different. Thus I have sent a pictures of the die. 

Malcolm,

Thank you. It is very clear!

have a nice day,

Anna

Anna,

I stand corrected. Whether the die is the same will depend on manufacturing site like Clemens said which is not something we can guarantee. I suggest you transition to an actual space rated part for consistency between dies:

SN54HC132-SP data sheet, product information and support | TI.com

Best,

Malcolm