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SN74AHC1G00-Q1: Rthja Conditions considered for the mentioned values

Part Number: SN74AHC1G00-Q1

Tool/software:

Hi,

I need to know the conditions considered for measuring the Rthja of "SN74AHC1G00QDCKRQ1"

  1. Board type used (is it FR4)
  2. Copper thickness of board in oz
  3. Pad layout: is it minimum recommended pad layout 
  • Hi Harish,

    The datasheet thermal metrics assume the JEDEC standard 2s2p (high-k) PCB, which is an FR4 four layer board.  The thickness of the top and bottom layers is 2 oz Cu and the internal planes are 1 oz Cu.  The trace layout is defined by JESD51-7 and is dependent on the package footprint.

    Regards,

    Owen