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SN74HC32: SO# 273947 - what is te difference between the E4 and the G4 plating material?

Adnan Zatarah
Intellectual 605 points
Part Number: SN74HC32

Tool/software:

Hello,

a customer stated that he needs only the SN74HC32NE4, but can't use the SN74HC32NG4 parts which we shipped..

I saw that the SN74HC32NG4 is not specifically orderable anymore and assume that we have both variants in our bin..

Can you please advise the differences between both?

I saw:

E4 – Pre-plated, NiPdAu

June 2004, TI defined ‘Green’ mold compound as:   Br or Sb < 0.1% by homogeneous weight

G4 – meant pre-plated with ‘Green’ mold compound

does this mean that the G4 parts have no Br or Sb anymore at all? Or are there additinal other differences?

Thank you very much

  • 0
    Guru 317370 points

    There is only a single variant sold by TI.

    The "4" indicates NiPdAu lead plating. ("3" would be Sn.) The "E" or "G" indicates the mold compound. So the lead plating would be the same for E4 and G4 devices.

    As shown on ti.com/quality-reliability-packaging-download/report?opn=SN74HC32N, the mold compound does not contain any halogen-based flame retardants. I do not know why TI kept the "E4" part number and dropped the "G4", but it makes no difference; all parts are "green".

    Please note that the environmental category printed on the chip is not necessarily the same as that in the orderable part number. If you order "E4" and get "G4", everything is OK.