• State TI Thinks Resolved
  • Locked Locked
  • Replies 2 replies
  • Answers 2 answers
  • Subscribers 21 subscribers
  • Views 192 views
  • Users 0 members are here
Support feedback
Options
Options
Related

This thread has been locked.

If you have a related question, please click the "Ask a related question" button in the top right corner. The newly created question will be automatically linked to this question.

SN74LVC1G07: Assembly for thermal interface on Package

Daisuke Nomura
Intellectual 950 points
Part Number: SN74LVC1G07

Tool/software:

Target device is SN74LVC1G07ZV

Customer try to use it and start the assembly for proto type.

This is a question about product assembly. After mounting the device on the board, they will be installing thermal interfaces, but they would like to know how much weight and load we can put on it. Please tell us the specifications and conditions for the load resistance (static load value). Could you answer this question?

  • 0
    TI__Genius 9851 points

    Hi Daisuke,

    This would depend on several factors not mentioned here, such as the VOH and pull up resistor used and the VCC the device is operating at. I recommend looking at the IOL in the datasheet and choosing a pull up resistor that satisfies that IOL. If you need help with this, please provide more details into your operating case.

    Best,

    Ian

  • 0
    Guru 317260 points

    I doubt that TI has any numbers for small BGA packages.

    But as long as the pressure is from above (i.e., no shear forces), and you're using a normal (i.e., somewhat soft) thermal pad, there will be no problem.