Part Number: SN74AHC1G125
Tool/software:
I’m having a little bit of trouble translating the exact change that is happening to the device mentioned in the subject line. It seems like there was an additionally Fab site qualified, as well as changes to the Process, Mount Compound, Bond Wire, Mold Compound, and Pin One Marking.
Are there any changes to the anticipated performance and datasheet parameters due to these changes?