Tool/software:
For the CDIP package, I am looking for thermal rise information between the junction and bottom case. Is this information available?
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Tool/software:
For the CDIP package, I am looking for thermal rise information between the junction and bottom case. Is this information available?
Hi Andrea,
We don't currently have that information. I can submit for a new thermal model to be built to provide that information, but it will take a few weeks.
Best,
Ian
Hi Andrea,
Please see below: