Tool/software:
Is it acceptable to connect the thermal pad of CD74AC238BQBR to circuit ground. (The datasheet only said - "The package thermal pad must be soldered to the printed circuit board for optimal thermal and mechanical performance.")
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Tool/software:
Is it acceptable to connect the thermal pad of CD74AC238BQBR to circuit ground. (The datasheet only said - "The package thermal pad must be soldered to the printed circuit board for optimal thermal and mechanical performance.")