Tool/software:
Greeting TI,
I have a question regarding the following:
Part #: CD74HC02M96
Part Description: 4-ch, 2-input, 2-V to 6-V 5.2 mA drive strength NOR gate
Based on the MDS of this part: https://www.ti.com/materialcontent/en/search?partType=tiPartNumber&partNumber=CD74HC02M96
I noticed that this part contains copper wire bonds. Is the process control for copper wire bonding for CD74HC02M96 qualified to AEC Q006 or similar? Any documentation or reference would be greatly appreciated!
Thank you.
