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SN74AUCH244: Question on Manufacturing Process and Rules on Parts with a VQFN (RGY) | 20 Package

James Leu
Prodigy 135 points
Part Number: SN74AUCH244


Tool/software:

Good evening, are the VQFN (RGY) | 20 Package family type designed to the same rules and manufacturing process on the same lines?

Is it valid to use the reliability data of the particular package family to which the part belongs or if we were to qualify it ourselves, we can qualify by similarity?

  • 0
    TI__Mastermind 27830 points

    Hi James,

    What do you mean by "on the same lines"?

    The package is the same but the part is different, and so manufacturing and test/quality will be different from other parts in the VQFN package. Package reliability data holds for package only and not necessarily for the device itself.

    Best,

    Malcolm

  • 0 in reply to Malcolm Lyn
    Prodigy 135 points

    I mean regarding the wire bonding. Like for instance if I do Destructive Physical Analysis (DPA) testing on a part number that has a VQFN package that contains copper wire bonds and it passed DPA testing. Would this hold true for other part numbers of that same package type? Are the wire bonding process the same for all VQFN 20 pin package type part numbers?

  • 0 in reply to James Leu
    TI__Mastermind 27830 points

    Hi James,

    James Leu said:
    Would this hold true for other part numbers of that same package type?

    No. Depending on the part number the die could be different (biggest difference would be 200mm vs 300mm die) which also means that the bond wires are different. I would expect it to be mostly the same for devices inside the same family.

    Best,

    Malcolm