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SN74LVC1G17-Q1: PCN : Table 5.4 thermal performance

Ross Parlour
Intellectual 1875 points
Part Number: SN74LVC1G17-Q1


Tool/software:

Hi,

My customer highlighted to me a PCN for this device. Although the PCN states “no change to form, fit or function” they have seen that there is a section that quotes changes to the thermals for the device configuration they use.

Extract from the PCN:

Basically, just the questions about Table 5.4 in the Rev D datasheet, has the thermal performance of the DBV/SOT23-5 package really changed dramatically as indicated in PCN#20250709002.2? Or is it just the same thermal performance now being quoted according to 'new' metrics when in the past it was quoted according to 'traditional' metrics?

BR, Ross 

  • 0
    TI__Genius 14381 points

    Hi Ross,

    It is a combination of both. Our thermal measurements are now more accurate than they have been in the past, and the shrinking of the die inside the package has made the thermals slightly worse.

    It is very rare for logic devices to be limited by their thermal values, so that is why their is no change to form, fit, or function.

    Regards,

    Owen