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need information

smitha pappu
Intellectual 670 points

Can you please provide the following information for the SN74AHCT132PWR part?

1.Junction Temperature Max (Tj Max)  

2.Typical Power, (Pd typ)             

3.Maximum Power (Pd max)     

4.Thermal Resistance Junction to Ambient (Theta JA)    

5.Thermal Resistance Junction to Board (Theta JB)          

6.Thermal Resistance Junction to Case (Theta JC)

  • 0
    TI__Mastermind 46480 points

    It did not copy too well. Let me know if you cannot read this

    Package Die Size
    (mils)     		Pad Size
    (mils)     		Low or
    High K     		Data
    Source     		Tja Pjt Tjc Tjp Tjb Derating
    Curve     		Update
    0 LFM 150 LFM 250 LFM 500 LFM 0 LFM 150 LFM 250 LFM 500 LFM
    14PW 48 x 53 71 x 71 High Model 112.6 105.6 102.3 97.0 2.40 4.00 4.60 5.60 46.6 72.7 Plot Update
  • 0 in reply to Chris Cockrill
    Intellectual 670 points

    Can you please provide Junction Temperature Max (Tj Max); Typical Power, (Pd typ); Maximum Power (Pd max)

  • 0 in reply to smitha pappu
    TI__Mastermind 46480 points

    The recommended maximum junction temperature is 105°C for long term reliability. The absolute maximum junction temperature is 150°C.

    Texas Instruments, Internal Web
    SemiconductorsStandard Linear & LogicAssembly and PackagingSearchFeedbackTI Home

    Thermal Database - Derating Curve Plot Results

    The requested derating curve plot is shown below. Values for the device junction temperature and the ambient temperature range can be varied and a new plot generated. Please see the text below for important information about these derating curves and the thermal models used to generate them.

    PLOT IMAGE

    Junction Temp: °C
    Ambient Temp Range: °C to °C

    Theta-ja: 112.6°C/W @ 0 lf/m
    Theta-ja: 105.6°C/W @ 150 lf/m
    Theta-ja: 102.3°C/W @ 250 lf/m
    Theta-ja: 97.0°C/W @ 500 lf/m

    Derating Factor

    Input realistic maxium junction temperature based off of mold compound Tg value and wire life data.
    If you need help please contact packaging.
    Max Junction = TA <= CTA = CTA = C
    Low/High KPackageDerating Factor
    Above TA    		TA <= 25CTA = 70CTA = 85C
    High 14PW -8.88 mW/C 888.10 mW 488.45 mW 355.24 mW

    Tj (°C) %FR
    (at 100,000 HR)
    150 96
    140 80
    130 46
    120 11
    110 1
    100 0.02
    		A direct relationship exists between junction temperature and device reliability. Therefore, the maximum allowable junction temperature is limited to 150°C. The table to the left shows the relationship between failure rate at 100,000 hours and junction temperature. This utility uses an initial value of 125°C for the device junction temperature.
    The derating curves above are generated from TI thermal models. These models are based upon TI package materials and run under specific environmental conditions. Should package material or environmental conditions change, actual measured values may differ from model results. Product data sheets should also be consulted to determine acceptable operating conditions, such as the operable ambient temperature range.

    Please see the Thermal Derating Curves for Logic-Products Packages application report for additional information.
  • 0 in reply to smitha pappu
    TI__Mastermind 46480 points

    The recommended maximum junction temperature is 105°C for long term reliability. The absolute maximum junction temperature is 150°C.

    Texas Instruments, Internal Web
    SemiconductorsStandard Linear & LogicAssembly and PackagingSearchFeedbackTI Home

    Thermal Database - Derating Curve Plot Results

    The requested derating curve plot is shown below. Values for the device junction temperature and the ambient temperature range can be varied and a new plot generated. Please see the text below for important information about these derating curves and the thermal models used to generate them.

    PLOT IMAGE

    Junction Temp: °C
    Ambient Temp Range: °C to °C

    Theta-ja: 112.6°C/W @ 0 lf/m
    Theta-ja: 105.6°C/W @ 150 lf/m
    Theta-ja: 102.3°C/W @ 250 lf/m
    Theta-ja: 97.0°C/W @ 500 lf/m

    Derating Factor

    Input realistic maxium junction temperature based off of mold compound Tg value and wire life data.
    If you need help please contact packaging.
    Max Junction = TA <= CTA = CTA = C
    Low/High KPackageDerating Factor
    Above TA    		TA <= 25CTA = 70CTA = 85C
    High 14PW -8.88 mW/C 888.10 mW 488.45 mW 355.24 mW

    Tj (°C) %FR
    (at 100,000 HR)
    150 96
    140 80
    130 46
    120 11
    110 1
    100 0.02
    		A direct relationship exists between junction temperature and device reliability. Therefore, the maximum allowable junction temperature is limited to 150°C. The table to the left shows the relationship between failure rate at 100,000 hours and junction temperature. This utility uses an initial value of 125°C for the device junction temperature.
    The derating curves above are generated from TI thermal models. These models are based upon TI package materials and run under specific environmental conditions. Should package material or environmental conditions change, actual measured values may differ from model results. Product data sheets should also be consulted to determine acceptable operating conditions, such as the operable ambient temperature range.

    Please see the Thermal Derating Curves for Logic-Products Packages application report for additional information.
  • 0 in reply to Chris Cockrill
    Intellectual 670 points

    Thank you Sir for the inputs provided. But I am unable to see the attached images.

  • 0 in reply to smitha pappu
    TI__Mastermind 46480 points

    I have attached a word file.

    ahct132pw.docx
  • 0 in reply to Chris Cockrill
    Intellectual 670 points

    Thankyou for the inputs provided