Tool/software:
Hi all,
Regarding the changes to the datasheet due to the addition of RFAB
In the datasheet of SN74LVC1G14, the thermal resistance value has changed significantly compared to the one before the update.
Example of SN74LVC1G14)
Junction-to-ambient: 247.2°C/W → 357.1°C/W
Junction-to-case (top): 154.5°C/W → 263.7°C/W
Junction-to-board: 86.8°C/W → 264.4°C/W
Junction-to-top characterization: 58.0°C/W → 195.6°C/W
Junction-to-board characterization: 86.4°C/W → 262.2°C/W
Is this significant change in the thermal resistance value due to the wafer diameter becoming 300 mm?
If you have any background information, I would appreciate it if you could provide it.
Best Regards,
Ryusuke
