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SN74LVC1G14: the changes to the datasheet due to the addition of RFAB

R.Fukunaga
Expert 2505 points
Part Number: SN74LVC1G14

Tool/software:

Hi all,

Regarding the changes to the datasheet due to the addition of RFAB

In the datasheet of SN74LVC1G14, the thermal resistance value has changed significantly compared to the one before the update.

Example of SN74LVC1G14)

Junction-to-ambient: 247.2°C/W → 357.1°C/W

Junction-to-case (top): 154.5°C/W → 263.7°C/W

Junction-to-board: 86.8°C/W → 264.4°C/W

Junction-to-top characterization: 58.0°C/W → 195.6°C/W

Junction-to-board characterization: 86.4°C/W → 262.2°C/W

Is this significant change in the thermal resistance value due to the wafer diameter becoming 300 mm?

If you have any background information, I would appreciate it if you could provide it.

Best Regards,

Ryusuke

  • 0
    TI__Mastermind 38095 points

    Hi Ryusuke,

    Yes, you are correct. The die and process has changed which is why the thermals will also change. 

  • 0 in reply to Albert Xu1
    Expert 2505 points

    Hi Albert,

    Thank you for your reply.

    Are the device performance degrading due to die and process changes?

    Are there any application notes or FAQs?

    I would like to understand the mechanism of thermal resistance changes due to die and mold changes.

    Best Regards,

    Ryusuke

  • +1 in reply to R.Fukunaga
    TI__Mastermind 38095 points

    Hi Ryusuke,

    Performance should not be affected poorly. \

    The thermal performance change is due to the fact that the die is smaller. Change in temperature has a higher effect because of this. 

    I don't think we have an app note or FAQ, but this is actually a good idea. I will talk with the team and see if we can have a short FAQ that describes this behavior.