• State Resolved
  • Replies 3 replies
  • Subscribers 20 subscribers
  • Views 89 views
  • Users 0 members are here
Support feedback
Options
Options
Related

Original question:

TLV316-Q1: IC AMP RtR SING LOW OFFSET SOT23-5 TLV316QDBVRQ1

SN74AHC1G08-Q1: IC PTA AND SOT23-5 QS SN74AHC1G08QDBVRQ1

Ajit Pande
Prodigy 65 points
Part Number: SN74AHC1G08-Q1

Tool/software:

IMDS Node ID 1093889247 / 1.00 is rejected . Need IMDS resubmission.

The IMDS record has been rejected. Please review and modify record as described below and re-submit data for acceptance.

1. In Components : SN74AHC1G08QDBVRQ1, IC Material : Sieg
The MDS has been hidden in IMDS and must be replaced.

2.In Components : SN74AHC1G08QDBVRQ1, IC Material: Die Attach Adhesive (Ag)
Please choose the Recyclate information (e.g. Does the material contain recyclate?: Yes / Not applicable / No ). Please choose the correct one as per the material (IMDS Rec.001, Rule 4.4.2.M&O).

  • 0
    TI__Mastermind 38535 points

    Hi Ajit,

    What are you looking for here? It is not clear. 

  • 0 in reply to Albert Xu1
    Prodigy 65 points

    We want iMDS resubmission. Current IMDS Node ID 1093889247 / 1.00 needs to be updated to new version .

    Below are the rejection reason.

    1. In Components : SN74AHC1G08QDBVRQ1, IC Material : Sieg
    The MDS has been hidden in IMDS and must be replaced.

    2.In Components : SN74AHC1G08QDBVRQ1, IC Material: Die Attach Adhesive (Ag)
    Please choose the Recyclate information (e.g. Does the material contain recyclate?: Yes / Not applicable / No ). Please choose the correct one as per the material (IMDS Rec.001, Rule 4.4.2.M&O).

     

  • 0 in reply to Ajit Pande
    TI__Mastermind 38535 points

    Hi Ajit,

    Understood now. The apps team does not handle IMDS submissions. Let me see if I can forward this request to the correct team.