Tool/software:
Hi
Could you please provide reliabilty data for the part SN74LVC2G17QDCKRQ1
following are the details needed.
sl no |
Information required |
SN74LVC2G17QDCKRQ1 |
1 |
Encapsulation/Housing Material |
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2 |
Part CTE ( (coefficient of thermal expansion) of the part that will induce stresses on the solder joint. This information is needed in order to determine if testing for thermal fatigue is needed. |
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3 |
Plating- Leadframe and plating materials affects the intermetalic structure of the solder joints. Changes in materials may require High Temp preconditioning and mechanical testing as well as thermal fatigue testing. |
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4 |
Wire bond material |
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5 |
Plating material |
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