SN74LVC2G17-Q1: reliability data for SN74LVC2G17QDCKRQ

Part Number: SN74LVC2G17-Q1

Tool/software:

Hi 

Could you please provide reliabilty data for the part SN74LVC2G17QDCKRQ1 

following are the details needed.

sl no

Information required

SN74LVC2G17QDCKRQ1 

1

Encapsulation/Housing Material

 

 

 

2

Part CTE ( (coefficient of thermal expansion) of the part that will induce stresses on the solder joint.  This information is needed in order to determine if testing for thermal fatigue is needed.

 

3

Plating- Leadframe and plating materials affects the intermetalic structure of the solder joints.  Changes in materials may require High Temp preconditioning and mechanical testing as well as thermal fatigue testing.

 

4

Wire bond material

 

5

Plating material