Tool/software:
Dear TI engineers,
I recently requested solder joint life test results for the TXU0204QPWRQ1 from your Customer Support Center (CSC), and they referred me to the following document:
TI's Technical document (szza026)
"Evaluation of Nickel/Palladium/Gold-Finished Surface-Mount Integrated Circuits"
I have a question about this technical document.
Q1. What are the temperature cycle test conditions?
e.g.: -40/+125°C, 30 min. each, 4000 cycles
Q2. Our customer's temperature cycle requirements for BLR evaluation are "-40/+125°C, 30 min. each, 3000 cycles."
Please provide numerical data or other evidence that acceleration performance is superior to the conditions you provided in Q1.
A calculation formula would be ideal.
Junji,
