FAQ: Logic and Voltage Translation > Power and Thermals >> Current FAQ
We have been updating the thermal values in our datasheet, so you may have received a notification about datasheet changes to the thermal values or noticed a datasheet revision about changes to thermal values.
During a routine datasheet update, this device’s thermal values (RΘJA, RΘJC(top), RΘJC(bot), RΘJB, ψJT, ψJB), as described in the Thermal Information Table, were updated to be more accurate. TI now uses an improved thermal model to calculate thermal impedance values, and these new thermal values may differ slightly from the existing values in the datasheet. The materials used, manufacturing process, and device core have not changed, so electrical performance will remain the same. Only the thermal characteristics of the datasheet have been updated.
The electrical characteristics, which are covered by production level die testing, will remain intact. There is no need to requalify the device since no physical change has been made. The definition for these parameters is determined by a JEDEC standard and is meant to serve as guidance and is not an accurate representation of all systems. The true thermal performance of any device will be impacted by external factors which are not accounted for by the thermal resistance for the device. For more information on TI’s semiconductor and IC package thermal metrics, please see the Application Note Semiconductor and IC Package Thermal Metrics.
