Part Number: SN74AHC1G32
We are using the SN74AHC1G32DCKR, covered by PCN 20240327004.1, which qualifies RFAB and additional assembly site.
We have observed that units assembled at the CDA assembly site appear to behave differently from units coming from the other qualified assembly sites under the same test and application conditions. According to the PCN, no impact on form, fit, function, quality or reliability is anticipated.
Could you please clarify whether any assembly-site-related differences in electrical or parametric values, test limits, or reliability are expected, and whether TI has received similar feedback for SN74AHC1G32DCKR or other devices in Group 6 of this PCN?
Thank you in advance