CD74ACT74: Confirmation on Copper Bond Wire Conversion for CD74ACT74M96 vs. SN74ACT74MDREP

Part Number: CD74ACT74

Hello TI team,

I am reviewing the CD74ACT74M96 device as an alternative to the SN74ACT74MDREP part. The SN74ACT74MDREP is currently listed on the TI website as NRND, so I am evaluating active devices within the same ACT logic family.

Before moving forward, I would like clarification on a few general items related to the device’s construction and published product information:

  1. Has the CD74ACT74M96 undergone a transition to copper bond wire as part of TI’s standard package updates?
  2. If so, did this material change affect the device’s form, fit, or function relative to the SN74ACT74MDREP part?

Our goal is to ensure FFF compatibility and reliability alignment for long-term support. 

Thank you for your assistance.