SN74AUP2G34: Can component be underfilled?

Jaz Kallirai

Part Number: SN74AUP2G34

Hi,

We are planning to use TI PN SN74AUP2G34YFPR on our Cuircut Board. Can the TI part be underfilled after soldereed onto the board?

Thank you,

Jaz

2 days ago

0 Malcolm Lyn 1 day ago

TI__Mastermind 34015 points

Hi Jaz,

What is underfilling? I am not familiar with this process or term.

Best,

Malcolm

0 Jaz Kallirai 1 day ago

Prodigy 10 points

Hi Malcolm,

Underfill is epoxy / polymer material we apply beneath the components (after soldered to the board) to fill the gap between the component and the printed circuit board

Thanks,

Jaz

+1 Malcolm Lyn 1 day ago in reply to Jaz Kallirai

TI__Mastermind 34015 points

Hi Jaz,

That is fine.

Best,

Malcolm

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SN74AUP2G34: Can component be underfilled?