SN74LVC1G126: bond wire

Yes, this is a standard and completely normal package construction for the SN74LVC1G126DCKR in its 5-pin SC70 (DCK) package. 

Observing a bond wire extending from the silicon die pad to the lead frame, along with a secondary bond wire directly connecting two separate lead-frame sections (often referred to as a lead-frame bridge bond, stitch bond, or down-bond), is a common practice in modern semiconductor packaging. Semiconductor manufacturers often design a single, standardized silicon die that is utilized across multiple package variants (e.g., SOT-23, SC70, DRL) or different pin configurations. Instead of spinning a completely new silicon design to match every unique internal lead-frame layout, the manufacturer uses lead-frame-to-lead-frame wire bonds to route common electrical nodes (like GND) to the appropriate external package pins