In QFN package, of TCA8418 IC, there is Thermal exposed PAD which need to be connected to the PCB substrate. My query is that, it is nowhere mentioned whether TP has to be connected to GND or POWER. Please clarify my doubt.
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In QFN package, of TCA8418 IC, there is Thermal exposed PAD which need to be connected to the PCB substrate. My query is that, it is nowhere mentioned whether TP has to be connected to GND or POWER. Please clarify my doubt.
It should be connected to gnd plane or floating plane. do not connect to power plane.