WHat are the parameters TI uses during production of this device for burn in? What temperature ranges are devices exposed to? How long are they subjected to this process?
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WHat are the parameters TI uses during production of this device for burn in? What temperature ranges are devices exposed to? How long are they subjected to this process?
There is no production burn in done on any standard logic or linear parts. It may be done on Hi-reliability or military parts but I dont know about them.