I am a layman trying to understand aspects of wafer fabrication. Could someone kindly explain whether single wafer RTP equipment is interchangeable with batch equipment in a semiconductor manufacturing line? If so, how feasible is substitution of this equipment, ie would it be extremely costly, would it significantly alter the manufacturing and/or design process, etc?
Also, I read some research materials that lump together oxidation and diffusion equipment in the same equipment category but, from what I can discern, these are different, non-analogous processes that are not substitutable for one another. Could you confirm whether my understanding of that is correct?
Finally, is Chemical Vapor Deposition an aspect or method of either oxidation or diffusion or is CVD a completely different thing?
Thanks for helping a rookie.
-Andrew
