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Hand soldering X2SON or DPW packages

Scott May
Prodigy 160 points
Other Parts Discussed in Thread: TPS3839

I see that TI have announced some nice mini logic devices in DPW (or X2SON) packages.  Looking at the package sheet:

http://www.ti.com/lit/ml/mpss039b/mpss039b.pdf

I'm trying to work out if I can hand solder these packages - and use boards that I can get made at my local guy (ie without using microvias and what not).  Does anyone have any tips on how to best use these packages?

I should add that I'm happy hand soldering fine pitch packages.  It's the centre pin that troubles me.

  • 0
    TI__Mastermind 46480 points

    The best packages to hand sloder would be the leaded versions like DCK ,DCU or DBV.

    You might be able to hand solder the X2Son package since the leads wrap around the side but I don know how you would solder the DPW package since one pad is in the center of the package.

  • 0
    Expert 1790 points
    I agree that it might be difficult to hand solder. I have had difficulty even reflow soldering (hobbyist).

    Note that soldering the center thermal pad might not be necessary for logic parts (there is an statement to that affect in TI's document SLUA271.) For power parts, and larger thinner parts, soldering the center pad is for thermal AND mechanical strength, for consumer applications. I haven't tried not soldering it, but it might work. I don't see how such a small part could get much mechanical stress from bending the PCB. I'm using the TPS3839 voltage monitor, I don't see how it could need a thermal sink at only 150nA.

    If you don't have to solder the center thermal pad, then you MIGHT be able to hand solder if you design your own lands that extend out far enough to get a very small soldering iron tip on, using a common technique of pre-soldering the lands, then reflowing them individually with a soldering iron. The land pattern recommended is NOT suitable for this, at least in my experience, I can't get a soldering iron tip into the joint.

    Finally, I'm dubious about TI's recommended land and solder paste stencils designs: the pin pads and the thermal pad are very close together. I tried it and got about 50% failure rate, again using hobbyist methods (polyamide stencils, hand placement, old solder paste, ancient reflow oven.)
  • 0 in reply to lloyd konneker
    Expert 1790 points
    Oops. I am using the DQN package of the TPS3839. Only 3 pins are connected and one is gnd, so I am assuming the thermal pad does not NEED to be grounded. Also the pitch is .65. Looking at the DPW package, it seems you would need to ground the center pad (the gnd pin, not for thermal reasons.) And the pitch is 0.5mm so even harder to hand solder.
  • 0 in reply to lloyd konneker
    TI__Guru 62050 points
    The center pad is gnd of the device for all little logic parts and needs to be soldered to system gnd. It cant be left floating for proper operation .
    0.64mm2 area of the device is a challenge to solder definitely .