Bond wires

Fubin,

Post moved to logic for best support.

Fubin,

What package size are you interested in?

SOIC-14 (D).

Another question is the Automotive one rated for -40 to 125C but the catalog is -55 to 125C? Right?

Fubin,

It looks like the orderable part number SN74HC14DRG4 is made with gold bond wires.

The part number SN74HC14 (catalog) has an operating range of -40 C to 85 C. The military grade part, SN54HC14, is rated -55 C to 125 C. The automotive qualified part, SN74HC14-Q1, is rated for -40 C to 125 C.

James,

Thanks a lot for the info. I think I mixed up things here. I compared CD74HC14 (HC14M marking) with SN74HC14 (HC14 marking). All the CD74HC14 devices are Harris Semi. They look really identical.

Here are few more questions:

1) Are all SN74HC14 devices made on the same silicon process? CD74HC14 too?

2) Are these devices using the same mold compound?

3) Are CD74HC14 device with Gold wires?

Thank you again for the info.

Regards,

Fubin

Hi Fubin, I am looking into this with the product engineering & packaging team. I will let you know as soon as I hear back.

-Ryan

Hi Fubin,
1. Yes.
2. Mold compound is package and site dependent. They will not always be the same. We will need to know the exact orderable part number for more info.
3. Wire is also package and site dependent. Same as #2, we need full orderable part #.

-Ryan

Hi Ryan, Thank you for looking into these. I was surprised that the catalog parts used the Gold wires but the Automotive switched to Copper wires. The problem I have here is the CD74HC14 SOIC-14 devices failed after extreme thermal shocks. Hopefully, your info can help me pick the best candidates.

Thanks again,

FZ

Ryan, one more quick question, which version of SOIC-14 is the best candidates for extreme thermal shock. Thanks,

Ryan,

Could you confirm if SN74HC14QDRQ1 device are made of gold wires or copper wires? Thank you!

Regards,

Fubin

The CD74HC14 are copper wires. I confirmed it. The thermal shocks were destructive and beyond the specs. Interestingly all other IC's on the same board survived. I thought it might be more convenient to look up the bond wire and mold compound info online rather than going through the forum. Thank you very much for the help!